Lv1
30 积分 2026-01-22 加入
A coupled finite element scheme to study the grinding force and warpage of silicon wafers during the backside grinding process
20天前
已完结
Surface shape control of the workpiece in a double-spindle triple-workstation wafer grinder
26天前
已完结
Nanogrinding of Silicon Wafer Using a Novel Vitrified Diamond Wheel
1个月前
已完结
Ultrathin Wafer Pre-Assembly and Assembly Process Technologies: A Review
1个月前
已完结
Robotic Perception of Transparent Objects: A Review
1个月前
已完结
Study on reaction mechanism of Si and pure CeO2 for chemical-mechanical-grinding process
1个月前
已完结
Anisotropic Material Removal Mechanisms and Chemical Mechanical Polishing Performance of Gallium Arsenide Single Crystal Wafers
2个月前
已完结
Insights into Interfacial Mechanism of CeO2/Silicon and Atomic-Scale Removal Process during Chemo-Mechanical Grinding of Silicon
2个月前
已完结
Electrochemical behavior and polishing properties of silicon wafer in alkaline slurry with abrasive CeO2
2个月前
已完结
Effect of graphene additions on polishing of silicon carbide wafer with functional PU/silica particles in CMP slurry
2个月前
已完结
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