Lv11
14 积分 2026-01-22 加入
Experimental analysis and low-damage machining strategy for composite ultrasonic vibration-assisted grinding of silicon carbide based on DA-MLP-NSGA-II algorithm
1小时前
待确认
Analytical modeling of ground surface topography in monocrystalline silicon grinding considering the ductile-regime effect
8小时前
已完结
Recent advances and applications of abrasive processes for microelectronics fabrications
22天前
已完结
Identification of subsurface damage of 4H-SiC wafers by combining photo-chemical etching and molten-alkali etching
26天前
已完结
A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy peeling and Excellent TTV for 3DIC
1个月前
已完结
Effects of taping on grinding quality of silicon wafers in backgrinding
1个月前
已完结
Critique of materials‐based models of ductile machining in brittle solids
1个月前
已完结
Surface and subsurface damage characteristics and material removal mechanism in 6H-SiC wafer grinding
1个月前
已完结
Study into grinding force in back grinding of wafer with outer rim
2个月前
已完结
A coupled finite element scheme to study the grinding force and warpage of silicon wafers during the backside grinding process
3个月前
已完结
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