Lv3
240 积分 2023-11-09 加入
Porosity reduction in inkjet-printed copper film by progressive sintering on nanoparticles
2个月前
已关闭
Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste
4个月前
已完结
Low‐Temperature Processible Highly Conducting Pastes for Printed Electronics Applications
6个月前
已完结
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