Lv3
248 积分 2023-11-09 加入
Printable and filament-drawable PDMS based adhesive assisted manufacturing of highly conductive copper micro-patterns
2个月前
已完结
High peel strength and excellent solder heat‐resistance epoxy adhesive for flexible copper clad laminate
3个月前
已完结
Silane modification of semi-curing epoxy surface: High interfacial adhesion for conductive coatings
4个月前
已完结
Fabricating flexible conductive structures by printing techniques and printable conductive materials
4个月前
已完结
Electroless copper deposition: A critical review
4个月前
已完结
Printing Conductive Nanomaterials for Flexible and Stretchable Electronics: A Review of Materials, Processes, and Applications
4个月前
已完结
3D printed electronics: Processes, materials and future trends
4个月前
已完结
Ligand‐Engineered Cu@Ni Core‐Shell Nanoparticles with Excellent Performance for Printed Electronics
8个月前
已完结
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