Lv31
270 积分 2022-12-30 加入
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
1个月前
已完结
Composite liquid cooling plate based on a micro-pin-finned vapor chamber for chip cooling in high heat flux applications
2个月前
已完结
Surrogate-assisted synergistic optimization of data center air-liquid hybrid cooling servers considering cooling power consumption and thermal reliability
2个月前
已完结
Thermal management enhancement of electronic chips based on novel technologies
2个月前
已完结
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