Lv3
360 积分 2026-04-14 加入
Material properties and grinding mechanism of SiC laser slicing wafers
9天前
已完结
Synergistic mechanism of multi-energy fields: achieving atomic-scale smooth GaN surfaces via ultrasonic vibration-assisted electrochemical mechanical polishing
9天前
已关闭
Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer
9天前
已完结
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer
9天前
已完结
An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
2个月前
已关闭
Optimization method for thinning process of monocrystalline silicon wafer focusing on fracture strength
2个月前
已完结
Residual stress distribution of silicon wafers machined by rotational grinding based on molecular dynamics
2个月前
已完结
Study on the Subsurface Damage Distribution of the Silicon Wafer Ground by Diamond Wheel
2个月前
已完结
The material removal and surface generation mechanism in ultra-precision grinding of silicon wafers
2个月前
已完结
Effects of wheel spindle vibration on surface formation in wafer self-rotational grinding process
2个月前
已完结
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