Lv31
330 积分 2026-04-14 加入
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding
15分钟前
待确认
Influence of H2O in bonding interfaces on bonding strength of plasma-activated bonded silicon oxide
19分钟前
待确认
Hybrid bonding technology for 3D Integration: Fundamentals, challenges, and perspectives
23分钟前
求助中
Influence of Annealing-Induced Edge Voids in Wafer-to-Wafer (W2W) Direct Bonding
2小时前
已完结
Material properties and grinding mechanism of SiC laser slicing wafers
4个月前
已完结
Synergistic mechanism of multi-energy fields: achieving atomic-scale smooth GaN surfaces via ultrasonic vibration-assisted electrochemical mechanical polishing
4个月前
已关闭
Experimental Investigation on Hybrid Technology of Ultrasonic Vibration Assisted Chemo-Mechanical Grinding (CMG) Silicon Wafer
4个月前
已完结
Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer
4个月前
已完结
An Investigation on the Total Thickness Variation Control and Optimization in the Wafer Backside Grinding Process
6个月前
已关闭
Optimization method for thinning process of monocrystalline silicon wafer focusing on fracture strength
6个月前
已完结
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