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60 积分 2026-07-30 加入
Uniformity improvement of deep silicon cavities fabricated by plasma etching with 12-inch wafer level
1个月前
已完结
Investigation of fluorocarbon plasma deposition from c‐C4F8 for use as passivation during deep silicon etching
1个月前
已完结
Characteristics of SiO2 Etching with a C4F8/Ar/CHF3/O2 Gas Mixture in 60-MHz/2-MHz Dual-frequency Capacitive Coupled Plasmas
2个月前
已完结
Analytical study of polymer deposition distribution for two-dimensional trench sidewall in low-k fluorocarbon plasma etching process
2个月前
已完结
On mechanisms to control SiO2 etching kinetics in low-power reactive-ion etching process using CF4 + C4F8 + Ar + He plasma
2个月前
已完结
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