Lv6
2120 积分 2024-07-03 加入
Suppression strategy for process-induced warpage of novel fan-out wafer level packaging
5个月前
已完结
Grinding of silicon wafers: A review from historical perspectives
5个月前
已完结
The 300 mm silicon wafer — a cost and technology challenge
5个月前
已完结
Feasibility Study of Uniform Residual Stress Measurement Using the Hole-Drilling Method and Digital Image Correlation
6个月前
已完结
The surface residual stress of monocrystalline silicon in ultrasonic vibration–assisted diamond wire sawing
6个月前
已完结
The microstructure and properties of novel TiO2@WC core–shell reinforced 316 stainless steel composite prepared by SLM
7个月前
已完结
Electrical and mechanical properties of a fully hydrogenated two-dimensional polyaniline sheet
7个月前
已完结
Strain localization in ductile single crystals
7个月前
已完结
Elastic Constants and Their Measurement
7个月前
已完结
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