Lv419
678 积分 2022-04-27 加入
3D integration of 2D electronics
1天前
已完结
Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
2天前
已完结
The CMOS 2.0 revolution
2天前
已完结
Wafer-to-wafer hybrid bonding at 400-nm interconnect pitch
2天前
已完结
Chirality engineering for carbon nanotube electronics
2天前
已完结
Artificial intelligence-based methods for renewable power system operation
2天前
已完结
Memristor-based hardware accelerators for artificial intelligence
2天前
已完结
Selective production of ethylene glycol at high rate via cascade catalysis
4天前
已完结
Nexus molecule outputs pure ethylene glycol
4天前
已完结
Continuous Cauchy wavelet transform analyses of EXAFS spectra: A qualitative approach
13天前
已完结
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