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18 积分 2025-07-03 加入
Preparation and characterization of Ag conductive adhesive with low resistivity
16天前
已完结
Omniphobic liquid-like surfaces
23天前
已完结
Self‐assembled monolayers for electrochemical migration protection of low‐temperature sintered nano‐Ag paste
1个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
1个月前
已完结
Preparation of Ag Nanoparticles Coated with Silver Stearate for Low-Temperature Sinter-Bonding
1个月前
已完结
Present status and prospects of nano-silver particles in the electronic field: a review
7个月前
已完结
Highly active bayberry-like porous silver microparticles for fabricating sintered silver with dispersed nanopores and adjustable Young’s modulus
9个月前
已完结
Electrolytic Synthesis and Tolyltriazole Modification of Dendritic Silver Powders for High‐performance Electrically Conductive Adhesives
10个月前
已完结
Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging
10个月前
已完结
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