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348 积分 2024-10-09 加入
Aerosol deposition of Al2O3 coating on Cu/diamond composite
2个月前
已完结
Recent Advances and Trends in Advanced Packaging
2个月前
已完结
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers
2个月前
已完结
Development of Straight, Small-Diameter, High-Aspect Ratio Copper-Filled Through-Glass Vias (TGV) for High-Density 3D Interconnections
2个月前
已完结
Electroplated Cu-Diamond Composite Thermal Vias for Interposer-Level Heat Management in 2.5D/3D Packages
2个月前
已完结
Review of the effect and progress in uniform films prepared by the magnetron sputtering method
3个月前
已完结
Recent Advances in Magnetron Sputtering: From Fundamentals to Industrial Applications
3个月前
已完结
Facilitating Complex Thin Film Deposition by Using Magnetron Sputtering: A Review
3个月前
已完结
Sputtering thin films: Materials, applications, challenges and future directions
3个月前
已完结
Gold film suppresses ablation damage of CVD polycrystalline diamond by sub-nanosecond pulsed laser processing: Experimental and theoretical investigation
3个月前
已完结
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