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464 积分 2024-10-09 加入
Microstructure and thermal conductivity of diamond/copper composite prepared by spark plasma sintering
16天前
已完结
Influence of Ti content on microstructure and thermal conductivity of diamond/Cu composites fabricated by spark plasma sintering
16天前
已完结
Micro-transfer printing of GaN HEMTs on engineered substrates for use in harsh environments
3个月前
已完结
Fabrication of AlGaN-GaN-InN High Electron Mobility Transistors
3个月前
已关闭
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
3个月前
已完结
AlGaN/GaN/3C-SiC on diamond HEMTs with thick nitride layers prepared by bonding-first process
3个月前
已完结
AlGaN/GaN/3C-SiC on diamond HEMTs with thick nitride layers prepared by bonding-first process
3个月前
已完结
Interfacial thermal resistance: Past, present, and future
3个月前
已完结
Topside Nanocrystalline Diamond Integration on AlGaN/GaN HEMTs for High Temperature Operation
3个月前
已完结
Reduced temperature in lateral (AlxGa1−x)2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond
3个月前
已完结
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