Lv4
474 积分 2024-10-09 加入
Micro-transfer printing of GaN HEMTs on engineered substrates for use in harsh environments
1个月前
已完结
Fabrication of AlGaN-GaN-InN High Electron Mobility Transistors
1个月前
已关闭
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C‐SiC/Diamond Junctions for Practical Device Processes
1个月前
已完结
AlGaN/GaN/3C-SiC on diamond HEMTs with thick nitride layers prepared by bonding-first process
1个月前
已完结
AlGaN/GaN/3C-SiC on diamond HEMTs with thick nitride layers prepared by bonding-first process
1个月前
已完结
Interfacial thermal resistance: Past, present, and future
1个月前
已完结
Topside Nanocrystalline Diamond Integration on AlGaN/GaN HEMTs for High Temperature Operation
1个月前
已完结
Reduced temperature in lateral (AlxGa1−x)2O3/Ga2O3 heterojunction field effect transistor capped with nanocrystalline diamond
1个月前
已完结
Explicit Thermal Resistance Model of Self-Heating Effects of AlGaN/GaN HEMTs with Linear and Non-Linear Thermal Conductivity
1个月前
已完结
Thermal Boundary Resistance Reduction by Interfacial Nanopatterning for GaN-on-Diamond Electronics Applications
1个月前
已完结
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