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290 积分 2021-05-27 加入
Numerical and experimental investigation of TPMS-structured cold plates for electronic device cooling
10个月前
已完结
Thermal management enhancement of electronic chips based on novel technologies
11个月前
已完结
High latent heat phase change materials (PCMs) with low melting temperature for thermal management and storage of electronic devices and power batteries: Critical review
11个月前
已完结
Recent advances in low-temperature phase change materials for cold chain logistics
11个月前
已完结
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