Lv11
90 积分 2026-01-05 加入
Study and control of the distortion induced by the bonding process for BSPDN approaches
3天前
已完结
Inline Bondwave Monitoring for Direct bonding, process optimization and impact on post bond distortion
3天前
已关闭
high precision low temperature direct wafer bonding technology for wafer level 3D ICs manufacturing
3天前
已关闭
Backside power delivery with relaxed overlay for backside patterning using extreme wafer thining and molybdenum- filled slit nano through silicon vias
10天前
已完结
Backside Power Delivery for Switched Designs in 2nm CMOS: IR Drop and Block-level Power-Performance- Area Benefits
17天前
已完结
IR Drop Analysis of Hybrid Bonded 3D ICs with Backside Power Delivery and μ n TSVs
1个月前
已完结
Comparison of Different Copper Nitride Passivation Layers Fabrication Methodology and Optimal Growth Condition for Low Temperature Copper-to-Copper Bonding in Advanced Packaging
1个月前
已关闭
Comparison of different copper nitride passivation layers fabrication methodology and optimal growth condition for low temperature copper-to-copper bonding in advanced packaging
1个月前
已完结
Increasing bushing temperature via a heating tube for performance enhancement of ion implanters
1个月前
已关闭
CoWoS package reliability risk assessment mitigation from mechanical perspectives
2个月前
已完结
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