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100 积分 2026-01-05 加入
Oxidation of Silicon, Silicon Carbide, and Silicon Nitride in Gases Containing Oxygen and Chlorine
3个月前
已完结
Oxidation of Silicon in the Presence of Chlorine and Chlorine Compounds
3个月前
已完结
Buried power rails and nano-scale TSV: Technology boosters for backside power delivery network and 3D heterogeneous integration
5个月前
已完结
Failure analysis of nano TSV process flow
5个月前
已完结
Thermal Impact of BSPDN for 3D Memory on logic integration
6个月前
已完结
Study and control of the distortion induced by the bonding process for BSPDN approaches
6个月前
已完结
Inline Bondwave Monitoring for Direct bonding, process optimization and impact on post bond distortion
6个月前
已关闭
high precision low temperature direct wafer bonding technology for wafer level 3D ICs manufacturing
6个月前
已关闭
Backside power delivery with relaxed overlay for backside patterning using extreme wafer thining and molybdenum- filled slit nano through silicon vias
6个月前
已完结
Backside Power Delivery for Switched Designs in 2nm CMOS: IR Drop and Block-level Power-Performance- Area Benefits
6个月前
已完结
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