Lv6
2528 积分 2025-05-22 加入
Low-Temperature Mechanical Properties of Welded and Brazed Copper
3个月前
已完结
Effects of zinc additions on the microstructure and melting temperatures of Al–Si–Cu filler metals
3个月前
已关闭
Preparation and properties of Cu6Sn5 intermetallic-bonded diamond grinding wheel for thinning SiC wafer
5个月前
已完结
Stable and efficient polishing of sapphire surface damage layers using polyurethane polishing wheel based on central supply polishing fluid
9个月前
已完结
Effect of TiO2/Al2O3 film coated diamond abrasive particles by sol–gel technique
9个月前
已完结
Insight into the Fracture Properties and Molecular Mechanism of Polyurethane
9个月前
已完结
An experimental investigation of silicon wafer thinning by sequentially using constant-pressure diamond grinding and fixed-abrasive chemical mechanical polishing
9个月前
已完结
Grinding wheels for manufacturing of silicon wafers: A literature review
10个月前
已关闭
Wear characteristics of electroplated diamond dressing wheels used for on-machine precision truing of arc-shaped diamond wheels
10个月前
已完结
Effects of processing parameters and grinding direction on the material removal mechanism of (100) surface single crystal diamond in self-rotating mechanical grinding
10个月前
已关闭
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