Lv21
130 积分 2025-12-25 加入
A Phase‐Change‐Enabled Thermal Interface Material With the Competitive Thermal Resistance of 0.03°C·cm 2 ·W −1 for Electronic Devices Thermal Management in AI Era
1小时前
待确认
Surface-Modified InVGr as a Thermal Interface Material with High Thermal Conductivity and Low Contact Thermal Resistance
11天前
已完结
Comprehensive insights into intrinsic thermal conduction mechanism of Sn-Bi-In alloys toward high-performance thermal interface materials: experimental and first-principles calculations
14天前
已完结
Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal
26天前
已完结
Interface regulation of diamond-doped GaInSn composites
1个月前
已完结
Boosted thermal conductivity and service stability of diamond/liquid-metal composites with immiscible Ag-W interlayer
1个月前
已完结
Liquid metal particles enabled ultrahigh isotropic thermal conductivity in soft thermal interface materials for biochips packaging
1个月前
已完结
Advanced Liquid‐metal Thermal Interface Materials via Gelation
1个月前
已完结
Bioinspired Non‐Embrittling Phase‐Inverted Oil‐in‐Liquid Metal Thermal Grease as a High‐Performance Thermal Interface Material
1个月前
已完结
High-strength liquid metal composite–hydrogel interfaces enable robust stretchable electronics
2个月前
已完结
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