Lv11
48 积分 2025-12-26 加入
Hydroxyl-Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging
27分钟前
待确认
High thermal conductivity diamond/SiC fibers/EP insulant composites with low permittivity prepared at different temperatures
1小时前
已完结
Interface-engineered liquid metal-composited hydrogels with high toughness and extreme flaw insensitivity for damage-tolerant wearables
1个月前
已完结
In-situ growth of diamond/Ag as hybrid filler for enhancing thermal conductivity of liquid crystal epoxy
1个月前
已完结
Interface-engineered liquid metal-composited hydrogels with high toughness and extreme flaw insensitivity for damage-tolerant wearables
1个月前
已完结
Compliant thermal interface materials via introducing pendent chains into polymer networks for chip cooling
4个月前
已完结
Evolution of Thermal Interface Material-to-Copper Interfacial Fracture Toughness Subjected to Monotonic and Fatigue Loading After Thermal Cycling
4个月前
已关闭
3D printed polylactic acid/graphene nanocomposites with tailored multifunctionality towards superior thermal management and high-efficient electromagnetic interference shielding
4个月前
已完结
A Flexible Thermal Interface Material as the Heat Switch for Solid-State Cooling
5个月前
已完结
Flexible thermal interface materials based on diamond–graphene composite films prepared at different temperatures
6个月前
已完结
皖公网安备34019202002308
