Lv11
68 积分 2024-02-29 加入
Surface Morphology of Electroless Copper Deposits Using Different Reducing Agents
4小时前
已完结
On the kinetics of copper electroless plating with hypophosphite reductant
1个月前
已完结
Flow and Heat Transfer Research in Space and Two-Phase System Experiment Platform on Aboard China Space Station
2个月前
已关闭
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
6个月前
已完结
EXPERIMENTAL STUDY OF POOL BOILING ON PIN-FINNED AND STRAIGHT-FINNED SURFACES ON AN INCLINED PLATE IN FC-72
1年前
已完结
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
1年前
已完结
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