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90 积分 2024-02-29 加入
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
28天前
已完结
EXPERIMENTAL STUDY OF POOL BOILING ON PIN-FINNED AND STRAIGHT-FINNED SURFACES ON AN INCLINED PLATE IN FC-72
10个月前
已完结
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
10个月前
已完结