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50 积分 2026-01-29 加入
First-principles analysis of structural stability, mechanical anisotropy, and thermophysical and electronic properties of Cu–Pd intermetallic compounds: a comparative study of CuPd, CuPd3, Cu3Pd, and Cu4Pd
13小时前
待确认
Physics-Informed Gaussian Process Classification for Constraint-Aware Alloy Design
21天前
已完结
Formation of an Ordered Structure in the Cu–50 at % Pd Alloy
1个月前
已完结
Formation of Short-Range Atomic Order in Cu–Pd Alloys with a Low Palladium Content: Resistometric Study
1个月前
已完结
Synergistic Dual Doping of Sulfur and Copper for Improved Thermoelectric Properties of Silver Selenide Nanomaterials
1个月前
已完结
Phase diagram determination using machine learning methods in materials science and engineering: a review
1个月前
已完结
Evolution of the microstructure, electrical resistivity and microhardness during atomic ordering of cryogenically deformed Cu-47at.%Pd alloy
1个月前
已完结
Atomic rearrangement process in the copper-gold alloy Cu3Au. II
1个月前
已完结
Untersuchungen zum Wiedemann-Franz-Lorenzschen Gesetz an ungeordneten und geordneten Phasen der Kupfer-Palladium-Legierungsreihe
1个月前
已完结
Variation of Hall Coefficient of Some Non-ferromagnetic Superlattice Alloys
1个月前
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