Lv41
758 积分 2026-04-04 加入
Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
1个月前
已完结
Solid State Diffusion Bonding Process-A Review
1个月前
已完结
Steady state creep of the silver-tin TLP interconnections of power modules
1个月前
已完结
Study of atomic diffusion behavior in diffusion welding of NiTi alloy - based on molecular dynamics
1个月前
已完结
Copper nanoparticle sintering technology for power electronics packaging-preparation, process, and performance
2个月前
已完结
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
3个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
3个月前
已完结
An inorganic-organic graded protection strategy via surface phosphating for superior antioxidant and sintering performance of copper pastes
3个月前
已完结
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