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918 积分 2026-04-04 加入
A comprehensive review of solid-state and transient liquid phase diffusion bonding: mechanisms, interfacial phenomena, process influences, and applications in similar and dissimilar materials
6小时前
待确认
Microstructural evolution of TLP bonding joints with high fraction of IMCs: effect on mechanical and fracture behavior under high current stressing
14天前
已完结
Microstructural evolution of TLP bonding joints with high fraction of IMCs: effect on mechanical and fracture behavior under high current stressing
26天前
已完结
Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al
2个月前
已完结
Solid State Diffusion Bonding Process-A Review
3个月前
已完结
Steady state creep of the silver-tin TLP interconnections of power modules
3个月前
已完结
Study of atomic diffusion behavior in diffusion welding of NiTi alloy - based on molecular dynamics
3个月前
已完结
Copper nanoparticle sintering technology for power electronics packaging-preparation, process, and performance
4个月前
已完结
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
4个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
4个月前
已完结
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