Lv3
270 积分 2023-11-30 加入
Dynamic “Scanning-Mode” Meniscus Confined Electrodepositing and Micropatterning of Individually Addressable Ultraconductive Copper Line Arrays
1天前
待确认
Meniscus-confined electrodeposition of metallic microstructures with in-process monitoring of surface qualities
9天前
已完结
Dynamic Electrolyte Spreading during Meniscus-Confined Electrodeposition and Electrodissolution of Copper for Surface Patterning
9天前
已完结
Modeling of heat partitioning and temperature rise at the tool-chip interface in diamond turning of the PBX surrogate
1个月前
已完结
Simulation and Experimental Study on Metal Microstructure of Meniscus‐Confined Electrodeposition
4个月前
已完结
Dynamic Electrolyte Spreading during Meniscus-Confined Electrodeposition and Electrodissolution of Copper for Surface Patterning
5个月前
已关闭
Fabrication of Cu-Ni Alloy Microcomponents using Localized Electrochemical Deposition
6个月前
已完结
High-performance all-solid-state thin-film lithium microbatteries based on wet-chemistry-prepared 3D CuO electrodes
11个月前
已完结
Conductive Gold Thin Film Prepared by the Two-Dimensional Assembly of Gold Nanoparticles on a Plastic Surface
11个月前
已完结
Surface Film Formation on Al-V Alloys with Far-From-Equilibrium Microstructure
1年前
已完结
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