Lv6
1815 积分 2023-10-20 加入
Failure Analysis on Abnormal Cracking of Flip-Chip Au Bumps During the High Temperature and Humidity Testing
1天前
待确认
Failure Case Studies of GaAs-Based Oxide-Confined VCSELs
18天前
已完结
Delamination and fracture of thin films
1个月前
已完结
On the decohesion of residually stressed thin films
1个月前
已完结
Residual stress improvement of platinum thin film in Au/Pt/Ti/p-GaAs ohmic contact by RF sputtering power
1个月前
已完结
Quantifying Electrochemical Processes Using Liquid Cell TEM
1个月前
已完结
Structure evaluation of the Ni3GaAs reaction layer formed on a GaAs(001) substrate using transmission electron microscopy
1个月前
已完结
Effect of post-growth cooling ambient on acceptor passivation in carbon-doped GaAs grown by metalorganic chemical vapor deposition
1个月前
已完结
Defect identification in electron-irradiated GaAs
1个月前
已完结
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