Lv41
462 积分 2025-09-09 加入
Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects
2小时前
待确认
Solder Volume Effect on Electromigration Failure Mechanism of Cu/Ni/Sn-Ag Microbumps
2小时前
待确认
Growth behavior and morphology of sidewall intermetallic compounds in Cu/Ni/Sn-Ag microbumps during multiple reflows
3小时前
已完结
Effects of amorphous Co W and Ni W barrier layers on the evolution of Sn/Cu interface
3小时前
求助中
Influences of Mono-Ni(P) and Dual-Cu/Ni(P) Plating on the Interfacial Microstructure Evolution of Solder Joints
3小时前
已完结
Self-Healing of Kirkendall Voids and IMC Growth in the Interfacial Reaction of Novel Ni/Cu bi-layer Barrier and Solder
3小时前
已完结
Nontrivial Effect of Ni Layer on Intermetallic Compounds Growth in Lead-Free Microbumps Under Coupled Thermal and Current Stress
3小时前
已完结
Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction
27天前
已完结
Effect of the reflow process on IMC growth for different devices and complex components
4个月前
已完结
A first-principles study on the ferroelectric and optical properties of (Zn, Co)-doped barium titanate
8个月前
已完结
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