Lv63
1980 积分 2025-07-22 加入
Promoter-driven recrystallization affording highly textured ruthenium
13天前
已完结
Promoter-driven recrystallization affording highly textured ruthenium
13天前
已完结
Grain rotation mechanisms in nanocrystalline materials: Multiscale observations in Pt thin films
18天前
已完结
Electron Backscattered Diffraction Analysis Of Narrow Copper Interconnects In Cross‐View To Investigate Scale Effect On Microstructure
21天前
已完结
High temperature shockwave stabilized single atoms
24天前
已完结
Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
1个月前
已完结
In situ observation of electromigration-induced void migration in dual-damascene Cu interconnect structures
1个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
1个月前
已完结
Two-Stage Electromigration Mechanism in Cu–Cu Direct Bonding Lines Revealed by In Situ Four-Dimensional Scanning Transmission Electron Microscopy
1个月前
已完结
43‐1: Invited Paper: The Latest Trends on CMOS Backplane for µLEDoS Microdisplay for AR Smart Glasses
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