Lv4
688 积分 2023-02-07 加入
Impact of Thermomechanical Fatigue and Creep on the Reliability of BGA Lead-Free Solder Joints in Electronic Modules
2个月前
已完结
Comparing and Benchmarking Fatigue Behaviours of Various SAC Solders under Thermo-Mechanical Loading
2个月前
已完结
Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)
2个月前
已完结
Multiscale characterization of the mechanical behavior of a printed circuit board (PCB)
3个月前
已完结
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
3个月前
已完结
Deep Learning Study on Memory IC Package Warpage Using Deep Neural Network and Finite Element Simulation
3个月前
已完结
Study on Warpage of Flip Chip Structure Based on Finite Element Analysis and Machine Learning Algorithm
3个月前
已完结
Warpage prediction and optimization in ultra-thin fan-out panel-level packaging substrates via equivalent CTE correction and multi-layer shell element modeling
3个月前
已完结
Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability
3个月前
已完结
Warpage Optimization of Package Substrates Using Metamodels - A Review
3个月前
已完结
皖公网安备34019202002308
