Lv6
2420 积分 2024-07-19 加入
Copper Filling of 100 nm Trenches Using PEG, PPG, and a Triblock Copolymer as Plating Suppressors
11天前
已完结
Smart Hydrogen-Bonded Organic Frameworks: From Design Rules to Applications
15天前
已完结
Theory of Filling of High-Aspect Ratio Trenches and Vias in Presence of Additives
18天前
已完结
A Comprehensive Review of Surface Roughness Effects on Microwave Performance of Transmission Lines
19天前
已完结
Electron mean free path in elemental metals
1个月前
已完结
Coordination Defect‐Induced Frustrated Lewis Pairs in Polyoxo‐metalate‐Based Metal–Organic Frameworks for Efficient Catalytic Hydrogenation
1个月前
已完结
Regulating the topology and pore size of covalent metal-organic framework for boosting catalytic CO2 conversion
1个月前
已完结
Advanced Electrochemical Processes for Sub-50 nm On-chip Metallization
1个月前
已完结
A novel model for through-silicon via (TSV) filling process simulation considering three additives and current density effect
1个月前
已完结
Solvent‐Driven Precise Control of Stacking Configurations in Covalent Organic Frameworks for High‐Efficiency Photocatalysis
2个月前
已完结
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