Lv64
2920 积分 2020-08-05 加入
Thermally conductive graphene-based Janus emitters with scalable fabrication for hybrid passive cooling of outdoor electronic devices
5天前
已关闭
Recent innovations in DRAM manufacturing
9天前
已完结
Cu pillar bump-on-trace (BoT) design for ultra low-k packaging
20天前
已完结
Measurement of back end of line thermal resistance for 3D chip stacks
28天前
已完结
Recent advances for thermal management of electronic devices: A state-of-the-art review
1个月前
已完结
A High-Performance piezoelectric micropump designed for precision delivery
2个月前
已完结
Piezoelectric micropumps: state of the art review
2个月前
已完结
A High Flow Rate Piezoelectric Micropump for Miniature Liquid Cooling System
2个月前
已完结
A thin and lightweight miniature loop heat pipe for cooling mobile electronic devices
2个月前
已完结
Optimized TIM1 Solution for Large 2.5D HPC Packages Using Silicone Matrix Containing Liquid Metal Materials
3个月前
已完结
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