Lv7
3460 积分 2020-08-05 加入
Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods
8天前
已完结
Governing Thermal Transport in Three-Dimensional Electronics
12天前
已完结
Thermal Behavior of Hybrid Bonding Interfaces in Advanced Packaging Technologies
18天前
已完结
Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
25天前
已完结
Highly energy-efficient manifold microchannel for cooling electronics with a coefficient of performance over 100,000
1个月前
已完结
Thermal Improvement of HBM with Joint Thermal Resistance Reduction for Scaling 12 Stacks and Beyond
1个月前
已完结
Warpage Simulation and Experimental Validation of the X-Dimension Fan-Out Integration-Bridge Wafer Level Packaging Process
1个月前
已完结
Time-domain electrical heating for broad-range and anisotropic thermophysical characterization of semiconductors
1个月前
已完结
High-Resolution Full-Chip Thermal Resistance Extraction of BEOL Interconnects in 3-D ICs Considering Detailed Via Connectivity
2个月前
已完结
Thermally conductive graphene-based Janus emitters with scalable fabrication for hybrid passive cooling of outdoor electronic devices
2个月前
已关闭
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