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40 积分 2025-09-15 加入
Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates
9天前
已完结
Compressive properties of porous Cu reinforced by inserting copper pillars or tubes
9天前
已完结
Stacking Fault and Plastic Deformation Mechanism in Nano‐twinned Cu Pillar under Ultrahigh Stress
9天前
已完结
The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps
9天前
已完结
Impacts of Pressure on the Stability of Chip Stack Structures in the Presence of Noncoplanar Cu Pillars
9天前
已完结
Large-scale silicon quantum photonics implementing arbitrary two-qubit processing
20天前
已完结
Fabrication of High Aspect Ratio TSV Interposer with Cu-Cu Direct Bonding
20天前
已完结
Study on the antioxidant properties of highly (111)-oriented nanotwinned-Cu
25天前
已完结
Strong localization of photons in certain disordered dielectric superlattices
1个月前
已完结
Inhibited Spontaneous Emission in Solid-State Physics and Electronics
1个月前
已完结
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