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30 积分 2025-09-15 加入
Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
1个月前
已完结
Cu to Cu direct bonding at low temperature with high density defect in electrodeposited Cu
1个月前
已完结
Low-Temperature Cu–Cu Bonding in Ambient Air via Glycerol-Assisted Sintering of Cu Nanowire Arrays
1个月前
已完结
Nanograin‐Twin‐Nanograin Alternating Composite Structure Enable Improved Cross‐Interface Cu─Cu Bonding at Low Thermal Budgets
2个月前
已完结
Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration
2个月前
已完结
Next Gen Laser Assisted Bonding (LAB) Technology
2个月前
已完结
Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era
2个月前
已完结
Effects of substrate bias on the sputtering of high density (111)-nanotwinned Cu films on SiC chips
2个月前
已完结
Large-scale production of nano-twinned, ultrafine-grained copper
2个月前
已完结
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