| 标题 |
The Assembly Investigation of a Multichip to PCB Flip-Chip Package Using Cu Pillar Bumps |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging, and Manufacturing Technology 作者:Zhibo Cao; Jens Lehmann; Bruno Heusdens; E. C. Durmaz; P. Krüger; et al 出版日期:2024-09-01 |
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(2025-6-4)