Lv51
1450 积分 2022-10-17 加入
Overview of monitoring methods of press‐pack insulated gate bipolar transistor modules under different package failure modes
6小时前
已完结
Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications
6小时前
已完结
Possible failure modes in Press-Pack IGBTs
6小时前
已完结
Silver Sintered Packaging Optimization for Enhancing Short-Circuit Withstand Capability of Press-Pack IGBT Devices
7小时前
已完结
Densification and mechanical properties of B4C-SiC-BN multiphase ceramics fabricated by reactive spark plasma sintering
1年前
已完结
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