Lv4
710 积分 2023-01-04 加入
Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits
16小时前
已完结
Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
6天前
已完结
Key properties of adhesives for successful photonic packaging
7天前
已完结
All-Optical Fiber–Visible Light Communication Approach for Wired–Wireless Communications: Architecture, Advantages, and Trends
8天前
已完结
Mid‐Infrared Free‐Space Optical Communications: Technologies, Demonstrations and Future Directions
8天前
已完结
Emerging near‐infrared luminescent materials for next‐generation broadband optical communications
8天前
已完结
Diverse Side-Chain Transformation of High Refractive Index Methylthio-Substituted Poly(phenylene sulfide)s
12天前
已完结
Thermally Stable UV-Curable Pressure-Sensitive Adhesives Based on Silicon–Acrylate Telomers and Selected Adhesion Promoters
1个月前
已完结
Surface plasma treatment effect on shear strength in adhesively bonded joints with modified addition curing silicone adhesive
3个月前
已完结
Revival of Cyclopolymerizable Monomers as Low-Shrinkage Cross-Linkers
6个月前
已完结
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