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1066 积分 2026-04-10 加入
Ultrastiff Biobased Epoxy Resin with High Tg and Low Permittivity: From Synthesis to Properties
6天前
已完结
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
6天前
已完结
A‐D‐A Structured Molecular Fillers for Boosting High‐Temperature Insulation of Polymer Dielectrics
7天前
已完结
Tailored Molecular Fillers Enable High‐Temperature Insulation and Long‐Term Operating Stability in All‐Organic Polymers
7天前
已完结
Benzene ring structural design strategy toward well-balanced thermal and electrical properties in epoxy dielectric polymers
7天前
已完结
Revolutionizing High‐Temperature Electrical Properties of Epoxy Resin via Tailoring Weak Conjugation Rigid Structures
7天前
已完结
Effect of Large Linking Groups on the Electrical and Thermal Properties of Aniline Cured Epoxy Resins
7天前
已关闭
Review of thermal conductivity in epoxy thermosets and composites: Mechanisms, parameters, and filler influences
13天前
已完结
Research on molecular dynamics and electrical properties of high heat-resistant epoxy resins
14天前
已完结
Effects of cross‐linked networks on dielectric properties of epoxy resins based on molecular dynamics
14天前
已完结
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