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10 积分 2024-07-02 加入
Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates
7小时前
已完结
Dimension-engineered sequential assembly of carbonene materials on arbitrary fiber substrates for electromagnetic interference shielding
9个月前
已完结
Fiber surfaces and interlaminar shear strengths of electrolytic Ni-plated carbon fiber/epoxy resin composites
9个月前
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