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100 积分 2025-07-29 加入
半导体狗
Burn-in stress induced BTI degradation and post-burn-in high temperature anneal (Bake) effects in advanced HKMG and oxynitride based CMOS ring oscillators
8天前
已完结
In-Product BTI Aging Sensor for Reliability Screening and Early Detection of Material at Risk
8天前
已完结
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
7个月前
已完结
Warpage and Stress Analysis in Molded 2.5D Package Chiplet Integration
7个月前
已完结
2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities
7个月前
已完结
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
7个月前
已完结
Analysis of Package-to-System Interaction on Thermal Performance of Large 2.5D Packages Using 3DFabric® Platform
7个月前
已完结
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
7个月前
已完结
Study of Fabrication and Reliability for the extremely large 2.5D advanced Package
7个月前
已完结
The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability
7个月前
已完结
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