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100 积分 2025-07-29 加入
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Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
1个月前
已完结
Warpage and Stress Analysis in Molded 2.5D Package Chiplet Integration
1个月前
已完结
2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities
1个月前
已完结
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
1个月前
已完结
Analysis of Package-to-System Interaction on Thermal Performance of Large 2.5D Packages Using 3DFabric® Platform
2个月前
已完结
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
2个月前
已完结
Study of Fabrication and Reliability for the extremely large 2.5D advanced Package
2个月前
已完结
The Extremely Large 2.5D Molded Interposer on Substrate (MIoS) Package Integration - Warpage and Reliability
2个月前
已完结
2.5D MCM (Multi-chip Module) Technology Development for Advanced Package
2个月前
已完结
Reliability Challenges from 2.5D to 3DIC in Advanced Package Development
2个月前
已完结
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