Lv21
110 积分 2025-07-29 加入
半导体狗
Copper Trace Thermomechanical Reliability Analysis of Ball Grid Array Package
2天前
已完结
Reliability Improvement Research of 2.5D CoWoS package
10天前
已完结
Burn-in stress induced BTI degradation and post-burn-in high temperature anneal (Bake) effects in advanced HKMG and oxynitride based CMOS ring oscillators
23天前
已完结
In-Product BTI Aging Sensor for Reliability Screening and Early Detection of Material at Risk
23天前
已完结
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling
7个月前
已完结
Warpage and Stress Analysis in Molded 2.5D Package Chiplet Integration
7个月前
已完结
2.5D/3D Packaging and Reliability: New Frontiers, Old Paradigms, and Opportunities
7个月前
已完结
Design Guideline of 2.5D Package with Emphasis on Warpage Control and Thermal Management
7个月前
已完结
Analysis of Package-to-System Interaction on Thermal Performance of Large 2.5D Packages Using 3DFabric® Platform
8个月前
已完结
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load
8个月前
已完结
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