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244 积分 2026-03-13 加入
Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils
10天前
已完结
Electrodeposition of Nano-Twinned Cu and their Applications in Electronics
10天前
已完结
Electrodeposition of (111)-oriented and nanotwin-doped nanocrystalline Cu with ultrahigh strength for 3D IC application
13天前
已完结
Substrate Engineering for High‐Performance Ultrathin Copper Foils: Unveiling the Electronic‐Geometric Synergy of Low‐Range‐Order Ni‐W Alloys
1个月前
已完结
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