Lv1
10 积分 2025-03-27 加入
Synthesis of adhesion promoter for lead frame bonding and application of epoxy composite materials
3小时前
待确认
Thermally conductive EMC (epoxy molding compound) for microelectronic encapsulation
4小时前
求助中
Engineering Benzoxazine/Epoxy/Imidazole Blends with Controllable Microphase Structures for Toughness Improvement
4小时前
待确认
Synthesis of adhesion promoter for lead frame bonding and application of epoxy composite materials
1天前
已完结
Optimizing dielectric, mechanical, and thermal properties of epoxy resin through molecular design for multifunctional performance
3个月前
已完结
Comparative studies of composites based on commercial epoxy resin with renewable resources-based tetra functional epoxy resin
3个月前
已完结
皖公网安备34019202002308
