Lv11
20 积分 2022-09-26 加入
Fully Subtractive Ru Topvia Interconnects with Minimum 9 nm-Space Airgap for RC Performance and Reliability Enhancement as Post-Cu Interconnects
5小时前
已完结
A Perspective on Interconnect Scaling Challenges in the NanoStack Transistor Era : AP/DFM: Advanced Patterning / Design for Manufacturing (Design-Technology Co-Optimization)
5小时前
已完结
Facilitating electroless metalization of blind holes in glass substrates by electrochemical discharge-assisted surface roughening
25天前
已完结
Alkyl-terminated PEG suppressors for copper electroplating and their hydrophilic and hydrophobic properties
1个月前
已完结
Bottom-up Gold Filling of Sub-Micrometer Trenches
1个月前
已完结
Investigation into the mechanism and performance of 4-aminopyrazolo[3,4-d]pyrimidine as a novel leveler for copper electroplating
1个月前
已完结
New strategy to fabricate a polydopamine functionalized self-supported nanoporous gold film electrode for electrochemical sensing applications
1个月前
已完结
Selective patterning on a flexible substrate using reduced graphene oxide-graphene and electroless deposited self-aligned silver conduction layers
1个月前
已完结
Graphene-Oxide-Assisted Electroless Cu Plating on a Glass Substrate
2个月前
已完结
Synthesis of ZnO-Based Adhesion Promoter Layer at Low Temperatures for Copper/Glass Metallization
2个月前
已完结
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