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12 积分 2022-09-26 加入
In-operando visualization of the dynamic microvia copper filling process for metal interconnection of integrated circuit
18天前
已关闭
Copper electrodeposition in a through-silicon via evaluated by rotating disc electrode techniques
18天前
已完结
Study on the 12 in. wafer uniformity of high aspect ratio TSV filling by using rotation cathode
18天前
已完结
Extreme Bottom-Up Superfilling of Through-Silicon-Vias by Damascene Processing: Suppressor Disruption, Positive Feedback and Turing Patterns
26天前
已完结
Single-additive TSV filling achieved with a tris-ammonium-based suppressor
1个月前
已完结
Atomic layer deposition of super conformal copper seed layer for ultra-high aspect ratio through-silicon-vias
1个月前
已完结
Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias
1个月前
已完结
Exploration of poly(1,4-butanediol diglycidyl ether, 2-methylimidazole, and imidazole) as leveling agents in blind hole copper plating
1个月前
已完结
Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy
1个月前
已完结
Role of a novel imidazolium-based leveler on the Cu electroplating for ultra-high aspect ratio through-silicon-vias
1个月前
已完结
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