An overview of cold spray coating in additive manufacturing, component repairing and other engineering applications

涂层 热喷涂 材料科学 气动冷喷涂 陶瓷 沉积(地质) 表面工程 机械工程 复合材料 纳米技术 工程类 古生物学 沉积物 生物
作者
Ashokkumar Mohankumar,D. Thirumalaikumarasamy,Tushar Sonar,Sampathkumar Deepak,P. Vignesh,Mani Anbarasu
出处
期刊:Journal of the mechanical behavior of materials [De Gruyter]
卷期号:31 (1): 514-534 被引量:25
标识
DOI:10.1515/jmbm-2022-0056
摘要

Abstract Cold spray process (CSP) is a thermal spray technology in which coating (10–40 µm) is formed in the solid state by the impingement of power particles with supersonic velocity (200–1,200 m/s 2 ) on coupon employing compressed gas jet, below the melting point of coating powder. It is commonly referred as cold gas dynamic spray, high velocity powder deposition, kinetic spray and kinetic energy metallisation process. Using CSP, various engineering materials (metals, polymers and ceramics) and its composites can be deposited. It is unique and promising approach for obtaining surface coating and offers various technological benefits over thermal spray as kinetic energy is employed for deposition rather than thermal energy. This offers great benefits in additive manufacturing (AM) to develop a component denser, low oxide coating free of tensile residual stresses, and undesired chemical reactions compared to conventional AM and coating techniques. Cold spray additive manufacturing (CSAM) is the powerful and emerging technique in the field of AM to develop engineering components with improved performance covering broad range of functionalities of surface, subsurface and interfaces. There are few flaws in this technique; however, extensive research work is going in CSAM and repairing of components to meet the real-time applications. The main objective of this review article is to summarise the history, effect of process parameters on surface coating, research and development in CSP along with its implementation in AM, component repairing and biomedical, antimicrobial and electrical applications. A discussion on future trends in CSAM is also provided at the end part of this article.
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