| 标题 |
Optimizing warpage in semiconductor packaging using GA-NN and conditional GAN with explainable AI |
| 网址 | |
| DOI | |
| 其它 |
期刊:Computers & Industrial Engineering 作者:Hung-Kai Wang; Yan-Cheng Lin; Tang-Yuan Chen; Chen-Chao Wang; Chin-Pin Hung 出版日期:2025-05-19 |
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(2025-6-4)