| 标题 |
Utilizing Silicone Gel Encapsulation in Power Semiconductor Module to Improve Manufacturability While Reducing Common-Mode Noise |
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期刊:IEEE Transactions on Power Electronics 作者:Sihoon Choi; Jiyoon Choi; Thiyu Warnakulasooriya; Jong-Won Shin; Jun Imaoka; et al 出版日期:2025-10-03 |
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(2025-6-4)