| 标题 |
Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials |
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| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:Xiangrong Chen; Qilong Wang; Xiaofan Huang; Muhammad Awais; Ashish Paramane; Na Ren 出版日期:2022-05-31 |
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(2025-6-4)