| 标题 |
Thermal Cycling Reliability Analysis of 2.5D Chiplet Based on Silicon Interposer |
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| DOI | |
| 其它 |
期刊:2024 International Applied Computational Electromagnetics Society Symposium (ACES-China) 作者:Xiang Li; Xiangkun Yin; Xiangyu Ma; Siquan Lyu 出版日期:2024-10-05 |
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(2025-6-4)