| 标题 |
Robust Design of Hybrid Bonding Considering Cu Pad Inelastic Deformation for Reliability |
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| DOI | |
| 其它 |
期刊:2026 IEEE 76th Electronic Components and Technology Conference (ECTC) 作者:Sang-Hoon Kim; Yeoun-Soo Kim; Haeri Kim; Jong Han Shin; Jiho Kang; et al 出版日期:2026-05-26 |
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(2025-6-4)