| 标题 |
MEAM molecular dynamics study of lead free solder for electronic packaging applications |
| 网址 | |
| DOI | |
| 其它 |
期刊:Modelling and Simulation in Materials Science and Engineering 作者:Hai Dong; Lianhua Fan; Kyoung-sik Moon; C P Wong; M I Baskes 出版日期:2005-11-05 |
| 求助人 | |
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(2025-6-4)