| 标题 |
Thermal Exposure Effects of Backside Thinned Flip-Chip Device on Visible Light Probing |
| 网址 | |
| DOI | |
| 其它 |
期刊:ISTFA 2018: Conference Proceedings from the 44th International Symposium for Testing and Failure Analysis 作者:Jane Li; Elia Halteh; Jonathon Elliott; Howard Lee Marks; Chris Richardson 出版日期:2018 |
| 求助人 | |
| 下载 |
PDF的下载单位、IP信息已删除
(2025-6-4)