| 标题 |
Soft Elastic, Thermally Conductive, Electrically Insulating h‐BN@EGaIn/Ecoflex Composites as Encapsulation and Thermal Interface Materials Applicated in Wearable Electronics |
| 网址 | |
| DOI | |
| 其它 |
期刊:Advanced materials and technologies 作者:Qiqi Fu; Zijian An; A. Dong; Shenglin Zhang; Weixin Zhou; et al 出版日期:2024-11-22 |
| 求助人 | |
| 下载 |
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(2025-6-4)