| 标题 |
 Damage detection technique using ultrasonic guided waves and outlier detection: Application to interface delamination diagnosis of integrated circuit package |
| 网址 | |
| DOI | |
| 其它 |
期刊：Mechanical Systems and Signal Processing 作者：Hyunseong Lee; Bonsung Koo; Aditi Chattopadhyay; Rajesh Kumar Neerukatti; Kuang C. Liu 出版日期：2021-04-10 |
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