| 标题 |
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE transactions on electromagnetic compatibility (Print) 作者:E. Li; Xing-Chang Wei; A. Cangellaris; En-Xiao Liu; Yaojiang Zhang; et al 出版日期:2010-05-18 |
| 求助人 | |
| 下载 | 求助已完成,仅限求助人下载。 |
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(2025-6-4)