| 标题 |
The High Frequency Electrical Properties of Interconnects on a Flexible Polyimide Substrate Including the Effects of Humidity |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Components, Packaging and Manufacturing Technology 作者:E McGibney; J Barton; L Floyd; P Tassie; J Barrett 出版日期:2011-03-18 |
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(2025-6-4)