| 标题 |
High‐performance Cu–Cu interconnects attained through air sintering of oleylamine‐capped Cu nanoparticles for power electronics packaging |
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| DOI | |
| 其它 |
期刊:Rare Metals 作者:Shiyu Xia; Xiangji Li; Ying‐Jie Guo; Junjie Yuan; Zhefei Sun; et al 出版日期:2025-02-03 |
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(2025-6-4)