| 标题 |
[高分]
Stress analysis and optimization of CSP solder joints in embedded substrates under torsional loading using a GA-BP neural network |
| 网址 | |
| DOI | |
| 其它 |
期刊:Welding in the World 作者:Lixiang Huang; Chunyue Huang; Chao Gao; Gui Wang 出版日期:2026-01-08 |
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(2025-6-4)