| 标题 |
 Coaxial Gate/Kelvin Interconnects for Reduced Gate Loop Inductance and Common Source Mutual Inductance in Power Semiconductor Packages |
| 网址 | |
| DOI |
10.1109/TCPMT.2026.3665992
doi
|
| 其它 |
期刊：IEEE Transactions on Components, Packaging and Manufacturing Technology 作者：Jack Knoll; Mark Cairnie; Christina DiMarino 出版日期：2026 |
| 求助人 | |
| 下载 |
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(2025-6-4)
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