| 标题 |
IGBT Junction Temperature Measurements: Inclusive of Dynamic Thermal Parameters |
| 网址 | |
| DOI | |
| 其它 |
期刊:IEEE Transactions on Device and Materials Reliability 作者:Jiangyong Zhang; Mingxing Du; Lei Jing; Kexin Wei; William Gerard Hurley 出版日期:2019-06-06 |
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(2025-6-4)